Electrical connectors of building integrable photovoltaic modules

ABSTRACT

Provided are novel building integrable photovoltaic (BIP) modules and methods of fabricating thereof. A module may be fabricated from an insert having one or more photovoltaic cells by electrically interconnecting and mechanically integrating one or more connectors with the insert. Each connector may have one or more conductive elements, such as metal sockets and/or pins. At least two of all conductive elements are electrically connected to the photovoltaic cells using, for example, bus bars. These and other electrical components are electrically insulated using a temperature resistant material having a Relative Temperature Index (RTI) of at least about 115° C. The insulation may be provided before or during module fabrication by, for example, providing a prefabricated insulating housing and/or injection molding the temperature resistant material. The temperature resistant material and/or other materials may be used for mechanical integration of the one or more connectors with the insert.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation of and claims priority to U.S. patentapplication Ser. No. 14/806,537, titled “ELECTRICAL CONNECTORS OFBUILDING INTEGRABLE PHOTOVOLTAIC MODULES,” filed Jul. 22, 2015, and nowU.S. Pat. No. 9,935,225, which is a continuation of U.S. patentapplication Ser. No. 13/046,461, tided “ELECTRICAL CONNECTORS OFBUILDING INTEGRABLE PHOTOVOLTAIC MODULES,” filed Mar. 11, 2011, and nowU.S. Pat. No. 9,112,080, all of which are incorporated herein byreference for all purposes.

BACKGROUND

Photovoltaic cells are widely used for electricity generation with oneor more photovoltaic cells typically sealed within and interconnected ina module. Multiple modules may be arranged into photovoltaic arrays usedto convert solar energy into electricity by the photovoltaic effect.Arrays can be installed on building rooftops and are used to provideelectricity to the buildings and to the general grid.

SUMMARY

Provided are novel building integrable photovoltaic (BIP) modules andmethods of fabricating thereof. A module may be fabricated from aninsert having one or more photovoltaic cells by electricallyinterconnecting and mechanically integrating one or more connectors withthe insert. Each connector has one or more conductive elements, such asmetal sockets and/or pins. At least two conductive elements areelectrically connected to the photovoltaic cells using, for example, busbars. These and other electrical components are electrically insulatedusing a temperature resistant material having a Relative TemperatureIndex (RTI) of at least about 115° C. or, at least in some cases atleast about 120° C., 125° C. 130° C., 135° C. or more. The RTI is themaximum service temperature at which the critical properties of amaterial will remain within acceptable limits over a long period oftime. The applicable standard is UL 746B, incorporated herein byreference. The insulation may be provided before or during modulefabrication by, for example, providing a prefabricated insulatinghousing and/or injection molding the temperature resistant material. Thetemperature resistant material and/or other materials may be used formechanical integration of the one or more connectors with the insert.

In certain embodiments, a method of fabricating a BIP module involvesproviding a photovoltaic module insert having one or more electricallyinterconnected photovoltaic cells and one or more bus bars extendingaway from at least one side of the insert. Two of the bus bars areelectrically connected to the photovoltaic cells. A connector memberhaving one or more conductive elements is also provided. The methodcontinues with electrically connecting at least one conductive elementto at least one bus bar. The method continues with forming a connectorbody around at least a portion of the connector member by injectionmolding a polymeric material, which may be a temperature resistantmaterial and/or other some other material. In either case, the resultingBIP module includes a temperature resistant material that has an RTI ofat least about 115° C. which covers at least the conductive element andthe bus bar.

In certain embodiments, a temperature resistant material includes one ormore of rigid materials. Some examples of rigid materials includepolyethylene terephthalate (e.g., RYNITE® available from Du Pont inWilmington, Del.), polybutylene terephthalate (e.g., CRASTIN® alsoavailable from Du Pont), nylon in any of its engineered formulations ofNylon 6 and Nylon 66, polyphenylene sulfide (e.g., RYTON® available fromChevron Phillips in The Woodlands, Tex.), polyamide (e.g., ZYTEL®available from DuPont), polycarbonate (PC), polyester (PE),polypropylene (PP), and polyvinyl chloride (PVC) and weather ableengineering thermoplastics such as polyphenylene oxide (PPO), polymethylmethacrylate, polyphenylene (PPE), styrene-acrylonitrile (SAN),polystyrene and blends based on those materials. Furthermore,weatherable thermosetting polymers, such as unsaturated polyester (UP)and epoxy, may be used. The properties of these materials listed abovemay be enhanced with the addition of fire retardants, color pigments,anti-tracking, and/or ignition resistant materials. In addition, glassor mineral fibers powders and/or spheres may be used to enhance thestructural integrity, surface properties, and/or weight reduction. Thematerials may also include additives such as anti-oxidants, moisturescavengers, blowing or foaming agents, mold release additives, or otherplastic additives. One or more of these additives may be also a part ofother non-temperature resistant materials used in forming a connectorbody or an overmold covering at least a portion of the connector body.In more specific embodiments, the material has an RTI of at least about125° C. or even an RTI of at least about 135° C.

In certain embodiments, a temperature resistant material may be at leastpartially enclosed in one or more of flexible materials. Some examplesof flexible materials include polyethylene, polypropylene, thermoplasticolefins, thermoplastic rubber, thermoplastic elastomer, ethylenepropylene diene, monomer (EPDM), fluoroelastomers or thermoplasticvulcanizates (TPV), and flexible cast thermoset materials, such asurethanes or silicones. In general, various flexible thermoplasticelastomers that have suitable thermally durable behavior may be used.Some specific examples include SANTOPRENE® (Supplied by Exxon Mobil inHouston, Tex.), HIPEX® (Supplied by Sivaco in Santa Clara, Calif.),EFLEX@ (Supplied by E-Polymers Co., Ltd. In Seoul, Korea), ENFLEX®(Supplied by Enplast Limited in Longford, Ireland), EXCELINK® (Suppliedby JSR Corporation in Tokyo, Japan), SYNOPRENE® (Supplied by SynoprenePolymers Pvt. Ltd. in Mumbai, India), Elastron® (Supplied by ElastronKimya in Kocaeli, Turkey). Some additional examples include nitrilebutadiene rubber (e.g., KRYNAC® (available from Lanxess in Maharashtra,India), NIPOL® (available from Zeon Chemicals in Louisville, Ky.) orNYSYN® (available from Copolymer Rubber & Chemicals in Batton Rouge,La.)), hydrogenated nitrile butadiene rubber (e.g., THERBAN® (availablefrom Lanxess in Maharashtra, India), ZETPOL® (available from ZeonChemicals in Louisville, Ky.)), and tetra-fluoro-ethylene-propylene(e.g., AFLAS® (Asahi Glass in Tokyo, Japan) and DYNEON BRF® (availablefrom 3M in St. Paul, Minn.) and VITON VTR® (available from DuPontPerformance Polymers in Wilmington, Del.)).

Some materials described above and elsewhere in this document mayinclude engineered polymers, which are specifically formulated to meetcertain requirements specific for photovoltaic applications. Forexample, certain hybrid block co-polymers may be used.

In more specific embodiments, a provided connector member includes aprefabricated insulating housing that at least initially mechanicallysupports and/or electrically insulates one or more conductive elements.The housing may be made from or include one or more temperatureresistant materials described above. In even more specific embodiments,a connector body is formed around the insulating housing by injectionmolding one or more of the flexible materials described above. Othermore specific examples are listed above. This connector body extendsover at least a portion of the photovoltaic module insert to providemechanical support to the connector with respect to the insert. Incertain embodiments, a housing includes one or more extension flapsforming an insulating sleeve around one or more bus bars extendingoutside the insert and connected to the one or more conductive elementsinside the insulating housing. In other embodiments, a fabricationprocess involves insulating such portions of the bus bars and/or otherelectrical components prior to forming the rest of the connector body.This insulation component may be formed by injection molding one or moretemperature resistant materials.

In certain embodiments, a connector body is formed using a temperatureresistant material without any additional materials molded over theconnector body. The connector body may extend over at least a portion ofthe insert to support the connector body with respect to the insert. Inother embodiments, fabrication of a module involves forming anadditional module overmold over at least a portion of the connector bodymade from the temperature resistance material. The module overmoldextends over at least a portion of the insert. In certain specificembodiments, both the overmold and the connector body extend over theinsert. The overmold may be made from one or more of the flexiblematerials listed above.

In certain embodiments, a connector body includes a cavity with aconductive element positioned inside the cavity, e.g., forming aconductive socket inside the cavity for receiving a conductive pin ofanother connector. The connector body may also include a seal positionedaround the cavity's opening. The seal may be formed by injection moldingof one or more of the flexible materials listed above. Other morespecific examples are listed above. When two connectors engage with eachother, one or two seals (e.g., one seal on each connector) protect theconductive elements of the two connectors from contaminations. In someembodiments, electrically connecting a conductive element of a connectormember to a bus bar of the insert involves aligning the connector memberwith respect to the insert. More specifically, the conductive element isaligned with respect to the bus bar. This alignment may be substantiallymaintained during one or more later operations, for example, duringformation of a connector body. Electrically connecting the conductiveelement to the bus bar may involve one or more of the followingtechniques: resistance welding, ultrasonic welding, laser welding, andsoldering.

Also provided are examples of BIP modules for use on buildingstructures, such as rooftops. In certain embodiments, a BIP moduleincludes an insert having one or more electrically interconnectedphotovoltaic cells and one or more bus bars extending away from theinsert. Two of these bus bars are electrically connected to the cells.The BIP module also includes one or more connectors including conductiveelements. At least two of these conductive elements electricallyconnected to the cells using two or more of the bus bars. One of theconnectors may have a connector body formed around its one or moreconductive elements and portions of the bus bars extending from theinserts and making electrical connections to the conductive elements.The connector body may be made from a temperature resistant materialhaving an RTI of at least about 115° C. or, more particularly, an RTI ofat least about 125° C.

In certain embodiments, a portion of a connector body or an overmoldover a connector body may be made from one or more of flexible materialslisted above. Other more specific examples are listed above. In general,these materials may be formed around a portion of the connector bodymade from one or more of the temperature resistant materials or aprefabricated connector described above. An insert of the BIP module mayhave one or more ventilation channels for cooling the module during itsoperation. In certain embodiments, an insert has a bus bar that is notelectrically connected to the photovoltaic cells. This bus bar mayextend from one side of the module to another and be used, for example,for making in-series electrical connections with other modules. This busbar may be electrically connected to a separate conductive element of aconnector. Another conductive element of the same connector may beelectrically connected to the photovoltaic cells.

These and other aspects of the invention are described further belowwith reference to the figures.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic cross-sectional side view of a building integrablephotovoltaic (BIP) module in accordance with certain embodiments.

FIG. 2 is a schematic top view of a BIP module in accordance withcertain embodiments.

FIG. 3 illustrates a subset of a photovoltaic array that includes sixBIP modules in accordance with certain embodiments.

FIG. 4 is a schematic illustration of a photovoltaic array installed ona rooftop of a building structure in accordance with certainembodiments.

FIG. 5 is a schematic representation of a photovoltaic module havingelectrically interconnected photovoltaic cells in accordance withcertain embodiments.

FIG. 6 is a schematic electrical diagram of a photovoltaic array havingthree BIP modules interconnected in series in accordance with certainembodiments.

FIG. 7 is a schematic electrical diagram of another photovoltaic arrayhaving three BIP modules interconnected in parallel in accordance withother embodiments.

FIGS. 8A-8C are schematic cross-sectional views of two connectorsconfigured for interconnection with each other in accordance withcertain embodiments.

FIG. 9 is a process flowchart corresponding to a method of fabricating aBIP module in accordance with certain embodiments.

FIG. 10A is a schematic representation of one example a BIP modulehaving a connector made entirely from a temperature resistant materialin accordance with certain embodiments.

FIG. 10B is a schematic representation of another example of a BIPmodule having a connector made from a prefabricated insulating housingand an overmold formed around the housing in accordance with certainembodiments.

FIG. 10C is a schematic representation of yet another example of a BIPmodule having an inner portion of the connector made from a temperatureresistant material and an outer portion of the connector made from adifferent material in accordance with certain embodiments.

FIG. 11 illustrates a schematic illustration of an alignment fixture atdifferent stages during the module fabrication process in accordancewith certain embodiments.

FIG. 12 is a schematic illustration of a connector member having twoflat conductive elements in accordance with certain embodiments.

DETAILED DESCRIPTION OF EXAMPLE EMBODIMENTS

In the following description, numerous specific details are set forth inorder to provide a thorough understanding of the present invention. Thepresent invention may be practiced without some or all of these specificdetails. In other instances, well known process operations have not beendescribed in detail to not unnecessarily obscure the present invention.While the invention will be described in conjunction with the specificembodiments, it will be understood that it is not intended to limit theinvention to the embodiments.

Building-integrable photovoltaic (BIP) modules are defined as speciallyconfigured photovoltaic modules that are used for integration intobuilding structures in various parts of buildings, such as rooftops,skylights, or facades. In certain examples, BIP modules replaceconventional building materials, such as asphalt shingles. Unliketraditional photovoltaic systems, BIP modules often do not requireseparate mounting hardware. As such, installed BIP modules providesubstantial savings over more traditional systems in terms of buildingmaterials and labor costs. For example, a substantial part oftraditional asphalt roof shingles may be replaced by “photovoltaicshingles.” In certain embodiments, photovoltaic shingles are installedon the same base roof structures as the asphalt shingles. In fact, arooftop may be covered by a combination of the asphalt and photovoltaicshingles. In certain embodiments, BIP modules are shaped like one or acollection of asphalt shingles. BIP modules may look and act much likethe asphalt shingles while producing electricity in addition toprotecting the underlying building structures from the environment. Incertain embodiments, BIP modules may be about 14 (e.g., 13.25) inches byabout 40 (e.g., 39.375) inches in size and may be stapled directly tothe roof deck through water barrier roofing cloth, for example.Generally, only a portion of the photovoltaic shingle is exposed, whilethe remaining portion is covered by other shingles. The exposed portionis referred to as the “shingle exposure”, while the covered portion isreferred to as the “flap.” For example, the shingle exposure of a 13.25inch by 39.375 inch shingle may be only about 5 inches wide or, in someembodiments, about 5.625 inches wide. The length of the shingle exposurein some of these embodiments may be 36 inches or about 39.375 inches (ifside skirts are not used, for example). Other dimensions of photovoltaicshingles may be used as well.

BIP modules described herein include designs capable of withstandinghigher operating temperatures typical for rooftops and other operatingenvironments. Electrical components of connectors and/or inserts areelectrically insulated using a temperature resistant material having aRelative Temperature Index (RTI) of at least about 115° C. In certainembodiments, higher RTI rated materials are used. An RTI is defined asthe maximum service temperature at which certain properties of thematerial remain within predetermined limits over a period of time. Morespecifically, an RTI may be defined as a maximum service temperature fora material where a class of critical property will not be unacceptablycompromised through chemical thermal degradation. This time frame mayspan over the reasonable life of an electrical product, relative to areference material. For example, a polymer with 115° C. RTI rating maypreserve at least 50% of its dielectric strength, tensile impactstrength, and/or tensile strength for the entire operating period of aBIP module (e.g., 15 or 20 years). Some examples of rigid materials thathave such RTI ratings are presented above. However, RTI rated materialsmay be expensive and often do not provide all needed properties, such asmechanical support, ductility, conformality, low cost, UV stability, andother characteristics. Other materials may also be used to form anovermold to provide additional mechanical support and/or electricalinsulation. In certain embodiments, polyethylene, polypropylene, and/orthermoplastic rubber is injection molded over the temperature resistantmaterials and at least a portion of the insert.

Furthermore, embodiments of BIP module designs provided herein areconfigured for rapid installation on building structures, such asbuilding rooftops, providing substantial labor savings. In certainembodiments, mechanical alignment of two BIP modules in the same rowalso results in electrical interconnection of the two modules. Inspecific embodiments, connectors are used to align one BIP module withrespect to another.

For purposes of this document, a BIP module is defined as an assembledunit ready for installation on a building structure. One particularexample of a BIP module is a photovoltaic shingle for installation onroof structures. A BIP module may be configured for direct connection toother BIP modules (i.e., connected only via BIP-integrated electricalconnectors) or indirect connection to other BIP modules (i.e.,connection via a separate connector not integrated with a BIP module). ABIP module typically is fabricated using a photovoltaic insert that hastwo or more integrated electrical connectors. Other components of BIPmodules may include moisture flaps (e.g., a top flap, which is sometimesreferred to as a “top lap” and/or a side skirt), mechanical supportsheets or components, sealing components, heat transfer features (e.g.,ventilation channels in a support sheet), and the like.

A photovoltaic insert is defined as a prefabricated photovoltaicsubassembly that forms part of a BIP module and used for itsfabrication. The insert includes one or more photovoltaic cells, e.g.,multiple electrically interconnected photovoltaic cells, sealing sheetsenclosing the cell or cells, cell-cell interconnectors (if necessary),electrical contacts extending out of the sealing sheets for establishingelectrical connections with the photovoltaic cells and other electricalcomponents of the insert. In certain embodiments, the insert includesone or more bus bars, or other electrically conductive componentsconfigured to carry current through an insert or BIP module. A bus barmay be made of a strip of highly conductive material, typically metal,for example copper, that is configured to carry a rated amount ofcurrent in the context of its operating environment. An insert mayinclude one or more bus bars that extends from one edge of the insert toanother without having any direct electrical connections to thephotovoltaic cells. An insert may also include one or more bus bars thatare configured for or in direct electrical communication with one ormore photovoltaic cells of the insert.

To provide a better understanding of various features of BIP modules andmethods of integrating connectors with photovoltaic inserts duringmodule fabrication, some examples of BIP modules will now be brieflydescribed. FIG. 1 is a schematic cross-sectional end view (line 1-1 inFIG. 2 indicates the position of this cross-section) of a BIP module 100in accordance with certain embodiments. BIP module 100 may have one ormore photovoltaic cells 102 that are electrically interconnected.Photovoltaic cells 102 may be interconnected in parallel, in series, orin various combinations of these. Examples of photovoltaic cells includecopper indium gallium selenide (CIGS) cells, cadmium-telluride (Cd—Te)cells, amorphous silicon (a-Si) cells, micro-crystalline silicon cells,crystalline silicon (c-Si) cells, gallium arsenide multi-junction cells,light adsorbing dye cells, organic polymer cells, and other types ofphotovoltaic cells.

Photovoltaic cell 102 has a photovoltaic layer that generates a voltagewhen exposed to sunlight. In certain embodiments, the photovoltaic layerincludes a semiconductor junction. The photovoltaic layer may bepositioned adjacent to a back conductive layer, which, in certainembodiments, is a thin layer of molybdenum, niobium, copper, and/orsilver. Photovoltaic cell 102 may also include a conductive substrate,such as stainless steel foil, titanium foil, copper foil, aluminum foil,or beryllium foil. Another example includes a conductive oxide ormetallic deposition over a polymer film, such as polyimide. In certainembodiments, a substrate has a thickness of between about 2 mils and 50mils (e.g., about 10 mils), with other thicknesses also within thescope. Photovoltaic cell 102 may also include a top conductive layer.This layer typically includes one or more transparent conductive oxides(TCO), such as zinc oxide, aluminum-doped zinc oxide (AZO), indium tinoxide (ITO), and gallium doped zinc oxide. A typical thickness of a topconductive layer is between about 100 nanometers to 1,000 nanometers(e.g., between about 200 nanometers and 800 nanometers), with otherthicknesses within the scope.

In certain embodiments, photovoltaic cells 102 are interconnected usingone or more current collectors (not shown). The current collector may beattached and configured to collect electrical currents from the topconductive layer. The current collector may also provide electricalconnections to adjacent cells as further described with reference to ofFIG. 5, below. The current collector includes a conductive component(e.g., an electrical trace or wire) that contacts the top conductivelayer (e.g., a TCO layer). The current collector may further include atop carrier film and/or a bottom carrier film, which may be made fromtransparent insulating materials to prevent electrical shorts with otherelements of the cell and/or module. In certain embodiments, a bus bar isattached directly to the substrate of a photovoltaic cell. A bus bar mayalso be attached directly to the conductive component of the currentcollector. For example, a set of photovoltaic cells may be electricallyinterconnected in series with multiple current collectors (or otherinterconnecting wires). One bus bar may be connected to a substrate of acell at one end of this set, while another bus bar may be connected to acurrent collector at another end.

Photovoltaic cells 102 may be electrically and environmentally insulatedbetween a front light-incident sealing sheet 104 and a back sealingsheet 106. Examples of sealing sheets include glass, polyethylene,polyethylene terephthalate (PET), polypropylene, polybutylene,polybutylene terephthalate (PBT), polyphenylene oxide (PPO),polyphenylene sulfide (PPS) polystyrene, polycarbonates (PC),ethylene-vinyl acetate (EVA), fluoropolymers (e.g., polyvinyl fluoride(PVF), polyvinylidene fluoride (PVDF), ethylene-terafluoethylene (ETFE),fluorinated ethylene-propylene (FEP), perfluoroalkoxy (PFA) andpolychlorotrifluoroethane (PCTFE)), acrylics (e.g., poly(methylmethacrylate)), silicones (e.g., silicone polyesters), and/or polyvinylchloride (PVC), as well as multilayer laminates and co-extrusions ofthese materials. A typical thickness of a sealing sheet is between about5 mils and 100 mils or, more specifically, between about 10 mils and 50mils. In certain embodiments, a back sealing sheet includes a metallizedlayer to improve water permeability characteristics of the sealingsheet. For example, a metal foil may be positioned in between twoinsulating layers to form a composite back sealing sheet. In certainembodiments, a module has an encapsulant layer positioned between one orboth sealing sheets 104, 106 and photovoltaic cells 102. Examples ofencapsulant layer materials include non-olefin thermoplastic polymers orthermal polymer olefin (TPO), such as polyethylene (e.g., a linear lowdensity polyethylene, polypropylene, polybutylene, polyethyleneterephthalate (PET), polybutylene terephthalate (PBT), polystyrene,polycarbonates, fluoropolymers, acrylics, ionomers, silicones, andcombinations thereof.

BIP module 100 may also include an edge seal 105 that surroundsphotovoltaic cells 102. Edge seal 105 may be used to secure front sheet104 to back sheet 106 and/or to prevent moisture from penetrating inbetween these two sheets. Edge seal 105 may be made from certain organicor inorganic materials that have low inherent water vapor transmissionrates (WVTR), e.g., typically less than 1-2 g/m²/day. In certainembodiments, edge seal 105 is configured to absorb moisture from insidethe module in addition to preventing moisture ingression into themodule. For example, a butyl-rubber containing moisture getter ordesiccant may be added to edge seal 105. In certain embodiments, aportion of edge seal 105 that contacts electrical components (e.g., busbars) of BIP module 100 is made from a thermally resistant polymericmaterial. Various examples of thermally resistant materials and RTIratings are further described below.

BIP module 100 may also have a support sheet 108 attached to back sidesealing sheet 106. The attachment may be provided by a support edge 109,which, in certain embodiments, is a part of support sheet 108. Supportsheets may be made, for example, from rigid materials. Some examples ofrigid materials include polyethylene terephthalate (e.g., RYNITE®available from Du Pont in Wilmington, Del.), polybutylene terephthalate(e.g., CRASTIN® also available from Du Pont), nylon in any of itsengineered formulations of Nylon 6 and Nylon 66, polyphenylene sulfide(e.g., RYTON® available from Chevron Phillips in The Woodlands, Tex.),polyamide (e.g., ZYTEL® available from DuPont), polycarbonate (PC),polyester (PE), polypropylene (PP), and polyvinyl chloride (PVC) andweather able engineering thermoplastics such as polyphenylene oxide(PPO), polymethyl methacrylate, polyphenylene (PPE),styrene-acrylonitrile (SAN), polystyrene and blends based on thosematerials. Furthermore, weatherable thermosetting polymers, such asunsaturated polyester (UP) and epoxy, may be used. The properties ofthese materials listed above may be enhanced with the addition of fireretardants, color pigments, anti-tracking, and/or ignition resistantmaterials. In addition, glass or mineral fibers powders and/or spheresmay be used to enhance the structural integrity, surface properties,and/or weight reduction. The materials may also include additives suchas anti-oxidants, moisture scavengers, blowing or foaming agents, moldrelease additives, or other plastic additives.

In certain embodiments, support sheet 108 may be attached to back sheet106 without a separate support edge or other separate supportingelement. For example, support sheet 108 and back sheet 106 may belaminated together or support sheet 108 may be formed (e.g., byinjection molding) over back sheet 106. In other embodiments backsealing sheet 106 serves as a support sheet. In this case, the sameelement used to seal photovoltaic cells 102 may be positioned over andcontact a roof structure (not shown). Support sheet 108 may have one ormore ventilation channels 110 to allow for air to flow between BIPmodule 100 and a building surface, e.g., a roof-deck or a waterresistant underlayment/membrane on top of the roof deck. Ventilationchannels 110 may be used for cooling BIP module during its operation.For example, it has been found that each 1° C. of heating from anoptimal operating temperature of a typical CIGS cell causes theefficiency loss of about 0.33% to 0.5%.

BIP module 100 has one or more electrical connectors 112 forelectrically connecting BIP module 100 to other BIP modules and arraycomponents, such as an inverter and/or a battery pack. In certainembodiments, BIP module 100 has two electrical connectors 112 positionedon opposite sides (e.g., the short or minor sides of a rectangularmodule) of BIP module 100, as for example shown in FIGS. 1 and 2, forexample. Each one of two electrical connectors 112 has at least oneconductive element electrically connected to photovoltaic cells 102. Incertain embodiments, electrical connectors 112 have additionalconductive elements, which may or may not be directly connected tophotovoltaic cells 102. For example, each of two connectors 112 may havetwo conductive elements, one of which is electrically connected tophotovoltaic cells 102, while the other is electrically connected to abus bar (not shown) passing through BIP module 100. This and otherexamples are described in more detail in the context of FIGS. 6 and 7.In general, regardless of the number of connectors 112 attached to BIPmodule 100, at least two conductive elements of these connectors 112 areelectrically connected to photovoltaic cells 102.

FIG. 2 is a schematic top view of BIP module 100 in accordance withcertain embodiments. Support sheet 108 is shown to have a side skirt 204and a top flap 206 extending beyond a BIP module boundary 202. Sideskirt 204 is sometimes referred to as a side flap, while top flap 206 issometimes referred to as a top lap. In certain embodiments, BIP module100 does not include side flap 204. BIP module boundary 202 is definedas an area of BIP module 100 that does not extend under other BIPmodules or similar building materials (e.g., roofing shingles) afterinstallation. BIP module boundary 202 includes photovoltaic cells 102.Generally, it is desirable to maximize the ratio of the exposed area ofphotovoltaic cells 102 to BIP module boundary 202 in order to maximizethe “working area” of BIP module 100. It should be noted that, afterinstallation, flaps of other BIP modules typically extend under BIPmodule boundary 202. In a similar manner, after installation, side flap204 of BIP module 100 may extend underneath another BIP modulepositioned on the left (in the same row) of BIP module 100 creating anoverlap for moisture sealing. Top flap 206 may extend underneath one ormore BIP modules positioned above BIP module 100. Arrangements of BIPmodules in an array will now be described in more detail with referenceto FIGS. 3 and 4.

FIG. 3 illustrates a photovoltaic array 300 or, more specifically aportion of a photovoltaic array, which includes six BIP modules 100a-100 f arranged in three different rows extending along horizontalrooflines in accordance with certain embodiments. Installation of BIPmodules 100 a-100 f generally starts from a bottom roofline 302 so thatthe top flaps of BIP modules 100 a-100 f can be overlapped with anotherrow of BIP modules. If a side flap is used, then the position of theside flap (i.e., a left flap or a right flap) determines which bottomcorner should be the starting corner for the installation of the array.For example, if a BIP module has a top flap and a right-side flap, theninstallation may start from the bottom left corner of the roof or of thephotovoltaic array. Another BIP module installed later in the same rowand on the right of the initial BIP module will overlap the side flap ofthe initial BIP module. Furthermore, one or more BIP modules installedin a row above will overlap the top flap of the initial BIP module. Thisoverlap of a BIP module with a flap of another BIP module creates amoisture barrier.

FIG. 4 is a schematic illustration of a photovoltaic array 400 installedon a rooftop 402 of a building structure 404 for protecting buildingstructure 404 from the environment as well as producing electricity inaccordance with certain embodiments. Multiple BIP modules 100 are shownto fully cover one side of rooftop 402 (e.g., a south side or the sidethat receives the most sun). In other embodiments, multiple sides ofrooftop 402 are used for a photovoltaic array. Furthermore, someportions of rooftop 402 may be covered with conventional roofingmaterials (e.g., asphalt shingles). As such, BIP modules 100 may also beused in combination with other roofing materials (e.g., asphaltshingles) and cover only a portion of rooftop. Generally, BIP modules100 may be used on steep sloped to low slope rooftops. For example, therooftops may have a slope of at least about 2.5-to-12 or, in manyembodiments, at least about 3-to-12.

Multiple BIP modules 100 may be interconnected in series and/or inparallel with each other. For example, photovoltaic array 400 may havesets of BIP modules 100 interconnected in series with each other (i.e.,electrical connections among multiple photovoltaic modules within oneset), while these sets are interconnected in parallel with each other(i.e., electrical connections among multiple sets in one array).Photovoltaic array 400 may be used to supply electricity to buildingstructure 404 and/or to an electrical grid. In certain embodiments,photovoltaic array 400 includes an inverter 406 and/or a battery pack408. Inverter 406 is used for converting a direct current (DC) generatedby BIP modules 100 into an alternating current (AC). Inverter 406 may bealso configured to adjust a voltage provided by BIP modules 100 or setsof BIP modules 100 to a level that can be utilized by building structure404 or by a power grid. In certain embodiments, inverter 406 is rated upto 600 volts DC input or even up to 1000 volts DC, and/or up to 10 kWpower. Examples of inverters include a photovoltaic static inverter(e.g., BWT10240-Gridtec 10, available from Trace Technologies inLivermore, Calif.) and a string inverter (e.g. Sunny Boy®2500 availablefrom SMA America in Grass Valley, Calif.). In certain embodiments, BIPmodules may include integrated inverters, i.e., “on module” inverters.These inverters may be used in addition to or instead of externalinverter 406. Battery pack 408 is used to balance electric power outputand consumption.

FIG. 5 is a schematic representation of a photovoltaic module insert 500illustrating photovoltaic cells 504 electrically interconnected inseries using current collectors/interconnecting wires 506 in accordancewith certain embodiments. Often individual cells do not provide anadequate output voltage. For example, a typical voltage output of anindividual CIGS cell is only between 0.4V and 0.7V. To increase voltageoutput, photovoltaic cells 504 may be electrically interconnected inseries for example, shown in FIG. 5 and/or include “on module” inverters(not shown). Current collectors/interconnecting wires 506 may also beused to provide uniform current distribution and collection from one orboth contact layers.

As shown in FIG. 5, each pair of photovoltaic cells 504 has oneinterconnecting wire positioned in between the two cells and extendingover a front side of one cell and over a back side of the adjacent cell.For example, a top interconnecting wire 506 in FIG. 5 extends over thefront light-incident side of cell 504 and under the back side of theadjacent cell. In the figure, the interconnecting wires 506 also collectcurrent from the TCO layer and provide uniform current distribution, andmay be referred to herein as current collectors. In other embodiments,separate components are used to for current collection and cell-cellinterconnection. End cell 513 has a current collector 514 that ispositioned over the light incident side of cell 513 but does not connectto another cell. Current collector 514 connects cell 513 to a bus bar510. Another bus bar 508 may be connected directly to the substrate ofthe cell 504 (i.e., the back side of cell 504). In another embodiment, abus bar may be welded to a wire or other component underlying thesubstrate. In the configuration shown in FIG. 5, a voltage between busbars 508 and 510 equals a sum of all cell voltages in insert 500.Another bus bar 512 passes through insert 500 without making directelectrical connections to any photovoltaic cells 504. This bus bar 512may be used for electrically interconnecting this insert in serieswithout other inserts as further described below with reference to FIG.6. Similar current collectors/interconnecting wires may be used tointerconnect individual cells or set of cells in parallel (not shown).

BIP modules themselves may be interconnected in series to increase avoltage of a subset of modules or even an entire array. FIG. 6illustrates a schematic electrical diagram of a photovoltaic array 600having three BIP modules 602 a-602 c interconnected in series usingmodule connectors 605 a, 605 b, and 606 in accordance with certainembodiments. A voltage output of this three-module array 600 is a sum ofthe voltage outputs of three modules 602 a-602 c. Each module connector605 a and 605 b shown in FIG. 6 may be a combination of two moduleconnectors of BIP modules 602 a-602 c. These embodiments are furtherdescribed with reference to FIGS. 8A-8C. In other words, there may be noseparate components electrically interconnecting two adjacent BIPmodules, with the connection instead established by engaging twoconnectors installed on the two respective modules. In otherembodiments, separate connector components (i.e., not integrated into orinstalled on BIP modules) may be used for connecting module connectorsof two adjacent modules.

Module connector 606 may be a special separate connector component thatis connected to one module only. It may be used to electricallyinterconnect two or more conductive elements of the same moduleconnector.

Sometimes BIP modules may need to be electrically interconnected inparallel. FIG. 7 illustrates a schematic electrical diagram of aphotovoltaic array 700 having three BIP modules 702 a-702 cinterconnected in parallel using module connectors 705 a and 705 b inaccordance with certain embodiments. Each module may have two bus barsextending through the module, i.e., a “top” bus bar 711 and a “bottom”bus bar 713 as shown in FIG. 7. Top bus bars 711 of each module areconnected to right electrical leads 704 a, 704 b, and 704 c of themodules, while bottom bus bars 713 are connected to left electricalleads 703 a, 703 b, and 703 c. A voltage between the top bus bars 711and bottom bus bars 713 is therefore the same along the entire row ofBIP modules 702 a-702 c.

FIG. 8A is a schematic cross-sectional side view of two connectors 800and 815 configured for interconnection with each other, in accordancewith certain embodiments. For simplicity, the two connectors arereferred to as a female connector 800 and a male connector 815. Each ofthe two connectors 800 and 815 is shown attached to its own photovoltaicinsert, which includes photovoltaic cells 802 and one or more sealingsheets 804. Connectors 800 and 815 include conductive elements 808 b and818 b, respectively, which are shown to be electrically connected tophotovoltaic cells 802 using bus bars 806 and 816, respectively.

In certain embodiments, a conductive element of one connector (e.g.,conductive element 808 b of female connector 800) is shaped like asocket/cavity and configured for receiving and tight fitting acorresponding conductive element of another connector (e.g., conductiveelement 818 b of male connector 815). Specifically, conductive element808 b is shown forming a cavity 809 b. This tight fitting and contact inturn establishes an electrical connection between the two conductiveelements 808 b and 818 b. Accordingly, conductive element 818 b of maleconnector 815 may be shaped like a pin (e.g., a round pin or a flatrectangular pin). A socket and/or a pin may have protrusions (not shown)extending towards each other (e.g., spring loaded tabs) to furtherminimize the electrical contact resistance by increasing the overallcontact area. In addition, the contacts may be fluted to increase thelikelihood of good electrical contact at multiple points (e.g., theflutes guarantee at least as many hot spot asperities of current flow asthere are flutes).

In certain embodiments, connectors do not have a cavity-pin design asshown in FIGS. 8A-8C. Instead, an electrical connection may beestablished when two substantially flat surfaces contact each other.Conductive elements may be substantially flat or have some topographydesigned to increase a contact surface over the same projection boundaryand/or to increase contact force at least in some areas. Examples ofsuch surface topography features include multiple pin-type or rib-typeelevations or recesses.

In certain embodiments, one or more connectors attached to a BIP modulehave a “touch free” design, which means that an installer can notaccidently touch conductive elements or any other electrical elements ofthese connectors during handling of the BIP module. For example,conductive elements may be positioned inside relatively narrow cavities.The openings of these cavities are too small for a finger to accidentlycome in to contact with the conductive elements inside the cavities. Onesuch example is shown in FIG. 8A where male connector 815 has a cavity819 b formed by connector body 820 around its conductive pin 818 b.While cavity 819 b may be sufficiently small to ensure a “touch free”designed as explained above, it is still large enough to accommodate aportion of connector body 810 of female connector 800. In certainembodiments, connector bodies 810 and 820 have interlocking features(not shown) that are configured to keep the two connectors 800 and 815connected and prevent connector body 810 from sliding outs of cavity 819b. Examples of interlocking features include latches, threads, andvarious recess-protrusion combinations.

FIG. 8B is schematic plan view of female connector 800 and maleconnector 815, in accordance with certain embodiments. Each connector800, 815 is shown with two conductive elements (i.e., conductive sockets808 a and 808 b in connector 800 and conductive pins 818 a and 818 b inconnector 815). One conductive element (e.g., socket 808 b and pin 818b) of each connector is shown to be electrically connected tophotovoltaic cells 802. Another conductive element of each connector800, 815 may be connected to bus bars (e.g., bus bars 809 and 819) thatdo not have an immediate electrical connection to photovoltaic cells 802of their respective BIP module (the extended electrical connection mayexist by virtue of a complete electrical circuit).

As shown, sockets 808 a and 808 b may have their own designated innerseals 812 a and 812 b. Inner seals 812 a and 812 b are designed toprovide more immediate protection to conductive elements 808 a and 818 aafter connecting the two connectors 800, 815. As such, inner seals 812 aand 812 b are positioned near inner cavities of sockets 808 a and 808 b.The profile and dimensions of pins 818 a and 818 b closely correspond tothat of inner seals 812 a and 812 b. In the same or other embodiments,connectors 800, 815 have external seals 822 a and 822 b. External seals822 a and 822 b may be used in addition to or instead of inner seals 812a and 812 b. Various examples of seal materials and fabrication methodsare described below in the context of FIG. 9. FIG. 8C is schematic frontview of female connector 800 and male connector 815, in accordance withcertain embodiments. Connector pins 818 a and 818 b are shown to haveround profiles. However, other profiles (e.g., square, rectangular) mayalso be used for pins 818 a and 818 b and conductive element cavities808 a and 808 b.

Having described some aspects of BIP modules and, more specifically,some aspects of electrical connectors attached to photovoltaic inserts,this document will now describe various examples of a process forfabricating BIP modules. Generally, the process involves electricallyconnecting conductive elements of the connector member and bus wires ofthe insert and forming a connector body around at least a portion of theconnector member and insert. FIG. 9 is a process flowchart correspondingto a process 900 for fabricating BIP modules in accordance with certainembodiments. Process 900 may start with providing a photovoltaic moduleinsert and a connector member in operation 902. Various examples ofphotovoltaic module inserts are described above, for example, in thecontext of FIGS. 1 and 5. In general, an insert includes one or moreelectrically interconnected photovoltaic cells and two or more bus barsextending away from at least one side of the insert. At least two ofthese bus bars are electrically connected to the photovoltaic cells.

The connector member provided in operation 902 includes at least oneconductive element. In certain embodiments, a connector member includestwo or more conductive elements. The connector member may be providedwith or without a prefabricated insulating housing. An insulatinghousing is typically made from one or more temperature resistantmaterials. Some examples of rigid materials with suitable thermalcharacteristics are provided above. In specific embodiments, aninsulating housing is made from a temperature resistant material havingan RTI of at least about 115° C. or, more particularly, having a RTI ofat least about 125° C. In certain embodiments, an insulating housing hasone or more extension flaps configured to cover and insulate a portionone or more bus bars extending out of the insert and connected toconductive elements positioned within the insulating housing. Theseextension flaps may be sufficiently flexible to allow accessing to theconductive elements in order to establish electrical connections betweenthe bus bars and conductive elements.

Process 900 may proceed with establishing one or more electricalconnections between one or more conductive elements of the connectormember and one or more bus bars extending from the inserts (block 904).The electrical connections may be established by resistance welding,ultrasonic welding, laser welding, soldering, crimping, applyingconductive adhesive, or any other suitable connection technique. Incertain embodiments, a photovoltaic insert is aligned with respect to aconnector member prior or during operation 904. This alignment may bemaintained during subsequent operations (e.g., operations 906 and/or 908further described below) or more generally until the connector isrigidly or semi-rigidly attached to the insert. An alignment fixture maybe used for this purpose. FIG. 11 illustrates a schematic illustrationof an alignment fixture 1108 in accordance with certain embodiments.Alignment fixture 1108 is shown at three stages of BIP modulefabrication process 900: during establishing an initial alignment(1110), during formation of a connector body (1120), and after removalof the alignment fixture (1130).

Alignment fixture 1108 may have a reference surface 1108 a forpositioning a photovoltaic insert 1102 and a reference fixture 1108 bfor positioning a conductive element 1106. As shown during stage 1110, aportion of conductive element 1106 and a portion of bus bar 1104 mayoverlap in an overlap area 1112. At this stage 1110, photovoltaic insert1102 is considered to be aligned with respect to conductive element1106. Conductive element 1106 and bus bar 1104 may be mechanicallyand/or electrically interconnected with each other in overlap area 1112using one or more attachment techniques described above.

Once the connection between conductive element 1106 and bus bar 1104 isformed, a connector body 1122 may be formed around conductive element1106 as shown in the next stage 1120. A portion 1124 of connector body1122 may extend over the connection area 1112 and, in certainembodiments, may extend over at least a portion of photovoltaic insert1102. This in turn may result in connector body 1122 being rigidly orsemi-rigidly attached to insert 1102. In this case, this extendedportion 1124 now provides sufficient alignment between the twocomponents. Alignment fixture 1108 may be removed at this point as shownduring stage 1130.

Process 900 may proceed with forming a connector body in operation 906.In certain embodiments, a connector body or some parts of it comes indirect contact with electrical components of the BIP module (e.g.,conductive elements of the connector member or bus bars extendingoutside of the insert). In these embodiments, a connector body may beformed using one or more temperature resistant materials. Some examplesof rigid materials with suitable thermal characteristics are providedabove. In specific embodiments, a temperature resistant material has anRTI of at least about 115° C. or, more particularly, an RTI of at leastabout 125° C. or even at RTI of at least about 135° C. The temperatureresistant material may include one or more of the following additives:mineral fillers, glass fillers, and flame retardants.

In other embodiments, a connector body formed in operation 906 does notdirectly contact electrical components of the BIP module and temperatureresistant materials may not be needed to form the connector body. Forexample, a connector member provided in operation 902 may include aninsulating housing that encloses all electrical components extendingoutside of the photovoltaic insert (e.g., enclosing its own conductiveelements and providing extensions tabs for bus wires extending outsideof the insert). In these embodiments, a connector body may be made frompolyethylene, polypropylene, thermoplastic rubber, thermoplasticelastomer, and ethylene propylene diene monomer. A connector body istypically formed using injection molding or other suitable techniques.

In certain embodiments, a connector body formed in operation 902 may beinsufficient to provide electrical insulation and/or mechanical support.In such situations, process 900 involves operation 908 during which anovermold is formed over a portion of the connector body and, in certainembodiments, a portion of the insert. Operation 908 is optional becausea connector body may be sufficient for the above recited purposedwithout a separate overmold. It should be noted that regardless of anovermold, a connector body may include a temperature resistant materials(e.g., provided as a part of prefabricated insulating housing and/ordeposited during operation 904) and, in certain embodiments, othermaterial (e.g., deposited during operation 904 and/or deposited duringoperation 906). Three specific examples are described below in thecontext of FIGS. 10A-10C.

Forming overmold in operation 908 may involve injection molding or anyother technique. Examples of materials that can be used for an overmoldinclude polyethylene, polypropylene, thermoplastic rubber, thermoplasticelastomer, ethylene propylene diene monomer (EPDM), variousfluoroelastomers or thermoplastic vulcanizates (TPV), and flexible castthermoset materials such as urethanes. In general, flexiblethermoplastic elastomers that have suitable thermally durable behaviormay be used. Some examples are provided above. An overmold generallyextends over at least a portion of the photovoltaic module insert and aportion of the connector body.

Process 900 may continue with forming one or more seals around variouscavities' openings in a connector body in operation 908. Various sealexamples are described above in the context of FIGS. 8A-8C. Seals may beformed by injection molding or other suitable techniques. In certainembodiments, a seal may be fabricated in a separate process and insertedinto the connector body during operation 908. For example, a seal may bean O-ring or more specifically a butyl rubber O-ring or flat ring.

Electrical Connector Examples

FIG. 10A is a schematic representation of one example of a BIP module1000 in accordance with certain embodiments. Some components of thisassembly are similar to an assembly described above in the context ofFIG. 8A. Specifically, BIP module 1000 includes one or more photovoltaiccells 802 sealed by one or more sealing sheets 804. BIP module 1000 alsoincludes one or more bus bars 806 extending outside of sealing sheets804 and making an electrical connection with connector element 808. Theconnector also has a connector body 1002 that electrically insulates andmechanically supports conductive element 808 with respect to sealingsheets 804 or more generally, an entire insert 1002. Since connectorbody 1002 is in direct contact with conductive element 808 and bus bar806, it is made from one or more temperature resistant materials, suchas a RTI rated materials listed above. BIP module 1000 also includes aseal 812 positioned around the opening of connector body for protectingconnector element 808 from contaminants after establishing a connectionwith another connector. As shown in FIG. 10A, there is no additionalovermold positioned around connector body 1002. Connector body 1002provides sufficient mechanical support and electrical insulation in thisexample.

However, making a complete connector out of RTI rated materials may beprohibitively expensive and/or may not provide certain characteristics,such as UV stability, mechanical support, and electrical insulation. Incertain embodiments, a connector may include an inner component madefrom one or more temperature resistant materials, such as RTI ratedmaterials, and an outer portion made from some other materials. Theinner portion contacts electrical components of the module (e.g., busbars and conductive elements) and may be configured to fully enclosethese components and prevent any contacts with an outer portion of theconnector made from other materials. The inner portion may come as aprefabricated insulating housing (e.g., with flap extensions) or formedcompletely or partially during one or more injection molding operationsduring the overall BIP module fabrication process described above. Forexample, a prefabricated insulating housing may only cover someelectrical components (e.g., conductive elements of the connector),while other (e.g., bus bars) may extend outside of the housing. Aseparate operation may be used to apply one or more temperatureresistant materials around the remaining exposed electrical componentsbefore forming the remainder of the connector body from othernon-temperature resistant materials.

FIG. 10B is a schematic representation of another example of a BIPmodule 1010 having a connector made from a prefabricated insulatinghousing 1012 and an overmold 1016 formed around housing 1012 inaccordance with certain embodiments. Insulating housing 1012 is shownwith extension flaps 1014 that insulate a portion of bus bar 806extending from sealing sheets 804. Insulating housing 1012 may bepartially or fully covered with overmold 1016. Overmold 1016 alsoextends over at least a portion of the insert 1002.

FIG. 10C is a schematic representation of yet another example of a BIPmodule 1020 having an inner portion 1022 of the connector made from atemperature resistant material and an outer portion 1026 of theconnector made from a different material in accordance with certainembodiments. Inner portion 1022 may be configured to insulate bothconductive element 808 and bus bar 806. In certain embodiments, innerportion 1022 may cover a portion of the photovoltaic insert 1002 as, forexample, shown in FIG. 10C. Inner portion 1022 is made from one or moretemperature resistant materials described above. Outer portion 1026 ismade from other generally less expensive materials that have differentfunctional characteristics (e.g., high UV stability).

CONCLUSION

Although the foregoing invention has been described in some detail forpurposes of clarity of understanding, it will be apparent that certainchanges and modifications may be practiced within the scope of theappended claims. It should be noted that there are many alternative waysof implementing the processes, systems and apparatus of the presentinvention. Accordingly, the present embodiments are to be considered asillustrative and not restrictive, and the invention is not to be limitedto the details given herein.

1. (canceled)
 2. A photovoltaic module comprising: a front sealingsheet; a back sealing sheet; a plurality of electrically interconnectedphotovoltaic cells sealed in a sealed space between the front sealingsheet and the back sealing sheet; a first bus bar electrically connectedto the photovoltaic cells and extending outside the sealed space; afirst conductive element outside the sealed space and electricallyconnected to the first bus bar; and an insulating housing that:comprises a temperature resistant material having a Relative TemperatureIndex (RTI) of at least about 115° C., covers the electrical connectionbetween the first bus bar and the first conductive element, and includesan extension flap that insulates at least a portion of the first bus barthat is outside the sealed space.
 3. The photovoltaic module of claim 2,wherein the extension flap comprises a flexible material.
 4. Thephotovoltaic module of claim 3, wherein the flexible material comprisesone or more of a polyethylene, a polypropylene, a thermoplastic olefin,a thermoplastic rubber, a thermoplastic elastomer, an ethylene propylenediene, a monomer (EPDM), a fluoroelastomer or a thermoplasticvulcanizate (TPV), and a flexible cast thermoset material, such as anurethane or a silicone.
 5. The photovoltaic module of claim 2, whereinthe insulating housing is offset from the front sealing sheet and fromthe back sealing sheet.
 6. The photovoltaic module of claim 2, thetemperature resistant material has a RTI of at least about 125° C. 7.The photovoltaic module of claim 6, the temperature resistant materialhas a RTI of at least about 135° C.
 8. The photovoltaic module of claim2, wherein a section of the insulating housing is positioned over oneof: the front sealing sheet and the back sealing sheet.
 9. Thephotovoltaic module of claim 2, wherein the insulating housing iscomprises a polyamide.
 10. The photovoltaic module of claim 9, whereinthe insulating housing further comprises glass fibers.
 11. Thephotovoltaic module of claim 2, further comprising an outer portion,wherein the outer portion: comprises a temperature resistant materialhaving a RTI of at least about 115° C., covers the insulating housing,and is positioned over one of: the front sealing sheet and the backsealing sheet.
 12. The photovoltaic module of claim 11, wherein theouter portion provides mechanical support between the insulatinghousing, the front sealing sheet, and the back sealing sheet.
 13. Thephotovoltaic module of claim 11, wherein: a first section of the outerportion is positioned over the front sealing sheet, and a first sectionof the insulating housing is positioned over front sealing sheet andinterposed between the front sealing sheet and the outer portion. 14.The photovoltaic module of claim 13, wherein a second section of theouter portion is positioned over the back sealing sheet.
 15. Thephotovoltaic module of claim 11, wherein: a first section of the outerportion is positioned over the back sealing sheet, and a first sectionof the insulating housing is positioned over back sealing sheet andinterposed between the back sealing sheet and the outer portion.
 16. Thephotovoltaic module of claim 15, wherein a second section of the outerportion is positioned over the back sealing sheet.
 17. The photovoltaicmodule of claim 11, wherein the outer portion includes a top sectionpositioned over a first part the front sealing sheet and a bottomsection positioned over a first part of the back sealing sheet.
 18. Thephotovoltaic module of claim 11, wherein the temperature resistantmaterial of the outer portion has a RTI of at least about 135° C. 19.The photovoltaic module of claim 11, wherein the outer portion comprisesa polyamide.
 20. The photovoltaic module of claim 19, wherein the outerportion further comprises glass fibers.
 21. The photovoltaic module ofclaim 2, further comprising: a second bus bar electrically connected tothe photovoltaic cells and extending outside the sealed space; and asecond conductive element outside the sealed space and electricallyconnected to the second bus bar, wherein: the insulating housing coversthe electrical connection between the second bus bar and the secondconductive element, and the insulating housing further includes a secondextension flap that insulates at least a portion of the second bus barthat is outside the sealed space.